Objective

Master high-performance PCB design techniques for complex electronics.

Key Learning Areas

• High-speed design principles (signal integrity, crosstalk, EMI/EMC).
• High-density interconnect (HDI) and blind/buried vias.
• Complex layer stack-up planning for high-speed interfaces.
• Advanced routing strategies for high-speed buses (DDR, PCIe, USB).
• Thermal management and analysis.
• Advanced power distribution network (PDN) design.
• Integration with mechanical CAD for enclosure fitting.
• Full design cycle simulation and validation.
• Preparing a complete manufacturing data package (Gerbers, drill files, assembly drawings).

Outcome

Graduates will be capable of designing high-speed, multi-layer PCBs used in products like industrial controllers, IoT devices, and embedded systems, meeting stringent industry standards.

Certificate

Level 3 Expert Certificate